Samsung Electronics has secured a contract worth more than $200 billion to supply chips to Broadcom, one of the largest deals in semiconductor history. The five-year agreement, running through 2030, centers on Samsung's 2-nanometer and below process technologies for Broadcom's AI accelerators.
The pact spans memory, foundry manufacturing and advanced packaging, including 2.3D and 2.5D integration. Samsung will supply next-generation high-bandwidth memory, HBM4 and HBM4E, alongside foundry-made logic chips — a combination that directly challenges TSMC's dominance in AI chip manufacturing.
The deal was announced Friday at an AI summit in San Francisco during a visit by South Korean President Lee Jae Myung. It comes as Samsung and SK Hynix race to win a bigger share of the AI infrastructure market, with South Korea committing to double its memory production capacity within five years. As a memorandum of understanding, the pact signals intent rather than a fully binding contract.