{"data":{"id":2074,"lang":"en","title":"Samsung Wins $200 Billion Chip Deal With Broadcom, Challenging TSMC","summary":"Samsung secured a five-year, $200 billion-plus deal to supply Broadcom with advanced 2nm chips and HBM4 memory, challenging TSMC's grip on AI chip manufacturing.","category":"business","category_label":"Business","published_at":"2026-07-26T06:02:10Z","updated_at":"2026-07-26T06:02:10Z","url":"https://techtools.cz/tools/news/article/2074-samsung-wins-200-billion-chip-deal-with-broadcom-challenging-tsmc","api_url":"https://techtools.cz/news-api/v1/articles/2074?lang=en","markdown_url":"https://techtools.cz/news-api/v1/articles/2074.md?lang=en","image_url":"https://fortune.com/img-assets/wp-content/uploads/2026/07/GettyImages-2284413802-e1785010814998.jpg","word_count":148,"reading_time_minutes":1,"sources":[{"url":"https://fortune.com/2026/07/25/samsung-200-billion-order-supply-2-nanometer-chips-broadcom/","domain":"fortune.com"},{"url":"https://www.bloomberg.com/news/articles/2026-07-25/samsung-inks-200-billion-chip-supply-with-broadcom","domain":"bloomberg.com"}],"translation":{"lang":"cs","id":2147,"title":"Samsung uzavřel s Broadcomem dohodu o čipech za 200 miliard dolarů, vyzývá TSMC","url":"https://techtools.cz/tools/news/clanek/2147-samsung-uzavrel-s-broadcomem-dohodu-o-cipech-za-200-miliard-dolaru-vyzyva-tsmc","api_url":"https://techtools.cz/news-api/v1/articles/2147?lang=cs"},"content":"Samsung Electronics has secured a contract worth more than $200 billion to supply chips to Broadcom, one of the largest deals in semiconductor history. The five-year agreement, running through 2030, centers on Samsung's 2-nanometer and below process technologies for Broadcom's AI accelerators.\n\nThe pact spans memory, foundry manufacturing and advanced packaging, including 2.3D and 2.5D integration. Samsung will supply next-generation high-bandwidth memory, HBM4 and HBM4E, alongside foundry-made logic chips — a combination that directly challenges TSMC's dominance in AI chip manufacturing.\n\nThe deal was announced Friday at an AI summit in San Francisco during a visit by South Korean President Lee Jae Myung. It comes as Samsung and SK Hynix race to win a bigger share of the AI infrastructure market, with South Korea committing to double its memory production capacity within five years. As a memorandum of understanding, the pact signals intent rather than a fully binding contract."}}