# Samsung Wins $200 Billion Chip Deal With Broadcom, Challenging TSMC

*2026-07-26 06:02 UTC · Business · 1 min read*

> Samsung secured a five-year, $200 billion-plus deal to supply Broadcom with advanced 2nm chips and HBM4 memory, challenging TSMC's grip on AI chip manufacturing.

Samsung Electronics has secured a contract worth more than $200 billion to supply chips to Broadcom, one of the largest deals in semiconductor history. The five-year agreement, running through 2030, centers on Samsung's 2-nanometer and below process technologies for Broadcom's AI accelerators.

The pact spans memory, foundry manufacturing and advanced packaging, including 2.3D and 2.5D integration. Samsung will supply next-generation high-bandwidth memory, HBM4 and HBM4E, alongside foundry-made logic chips — a combination that directly challenges TSMC's dominance in AI chip manufacturing.

The deal was announced Friday at an AI summit in San Francisco during a visit by South Korean President Lee Jae Myung. It comes as Samsung and SK Hynix race to win a bigger share of the AI infrastructure market, with South Korea committing to double its memory production capacity within five years. As a memorandum of understanding, the pact signals intent rather than a fully binding contract.

## Sources

- [fortune.com](https://fortune.com/2026/07/25/samsung-200-billion-order-supply-2-nanometer-chips-broadcom/)
- [bloomberg.com](https://www.bloomberg.com/news/articles/2026-07-25/samsung-inks-200-billion-chip-supply-with-broadcom)

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TechTools News · https://techtools.cz/tools/news/article/2074-samsung-wins-200-billion-chip-deal-with-broadcom-challenging-tsmc
Česká verze: https://techtools.cz/tools/news/clanek/2147-samsung-uzavrel-s-broadcomem-dohodu-o-cipech-za-200-miliard-dolaru-vyzyva-tsmc