# Broadcom Seeks Up to $100 Billion in Debt Financing to Fuel AI Chip Buildout *2026-08-23 02:01 UTC · Business · 1 min read* > Broadcom is in talks for up to $100 billion in debt financing to fund AI chip and data-center commitments to Anthropic, in one of tech's largest-ever borrowing deals. Broadcom is negotiating one of the largest debt financings in tech history — up to $100 billion — to fund AI infrastructure built around its chip and data-center commitments to Anthropic, according to a report this week. The package would combine $60-70 billion in senior secured notes with roughly $30 billion in junior financing, arranged with partners Blackstone and Apollo Global Management. The financing follows a $35 billion facility Broadcom extended to Anthropic in June through its AI XPV Platform, and comes as Broadcom projects AI chip revenue topping $100 billion next year, with Anthropic alone expected to account for more than 40% of that total. The debt would back data centers targeting over 1 gigawatt of capacity by year's end and more than 20 gigawatts through 2028. The deal underscores how deeply chipmakers are now embedded in financing the AI buildout, using long-term silicon supply agreements as effective collateral for borrowing. It adds to a broader wave of AI-linked debt — including AMD's recent $4.75 billion bond offering and Nvidia's $500 billion infrastructure financing initiative — that has pushed hidden AI-sector borrowing past $1.6 trillion by some estimates. ## Sources - [siliconangle.com](https://siliconangle.com/2026/08/20/broadcom-reportedly-seeking-up-to-100b-in-debt-financing-for-ai-chip-deal/) - [bloomberg.com](https://www.bloomberg.com/news/articles/2026-08-20/broadcom-seeks-more-than-60-billion-in-latest-ai-debt-deal) --- TechTools News · https://techtools.cz/tools/news/article/2237-broadcom-seeks-up-to-100-billion-in-debt-financing-to-fuel-ai-chip-buildout Česká verze: https://techtools.cz/tools/news/clanek/2310-broadcom-hleda-dluhove-financovani-az-za-100-miliard-dolaru-na-rozjezd-ai-cipu