{"data":{"id":1653,"lang":"en","title":"TSMC Raises 2030 Global Chip Market Forecast 50% to $1.5 Trillion, Says AI and HPC Will Be 55% of Demand","summary":"TSMC raised its 2030 chip market forecast 50% to $1.5 trillion at its May 15 symposium, with AI and HPC expected to drive 55% of demand.","category":"business","category_label":"Business","published_at":"2026-05-15T14:02:12Z","updated_at":"2026-05-15T14:02:12Z","url":"https://techtools.cz/tools/news/article/1653-tsmc-raises-2030-global-chip-market-forecast-50-to-1-5-trillion-says-ai-and-hpc","api_url":"https://techtools.cz/news-api/v1/articles/1653?lang=en","markdown_url":"https://techtools.cz/news-api/v1/articles/1653.md?lang=en","image_url":"https://www.gadgetpilipinas.net/wp-content/uploads/2026/05/TSMC-banner-1920x1080.jpg","word_count":156,"reading_time_minutes":1,"sources":[{"url":"https://www.manilatimes.net/2026/05/15/business/foreign-business/tsmc-says-global-chip-market-to-hit-15-trillion-by-2030-as-ai-drives-growth/2344181","domain":"manilatimes.net"},{"url":"https://finance.yahoo.com/sectors/technology/articles/tsmc-says-global-chip-market-020630963.html","domain":"finance.yahoo.com"}],"translation":{"lang":"cs","id":1726,"title":"TSMC zvýšil prognózu globálního trhu s čipy pro rok 2030 o 50 % na 1,5 bilionu dolarů, AI a HPC budou 55 % poptávky","url":"https://techtools.cz/tools/news/clanek/1726-tsmc-zvysil-prognozu-globalniho-trhu-s-cipy-pro-rok-2030-o-50-na-1-5-bilionu","api_url":"https://techtools.cz/news-api/v1/articles/1726?lang=cs"},"content":"TSMC told investors at its annual technology symposium on May 15, 2026 that the global semiconductor market will exceed $1.5 trillion by 2030, a 50% jump from its previous $1 trillion forecast. AI and high-performance computing will account for 55% of that market, with smartphones at 20% and automotive at 10%.\n\nTo meet demand, the world's largest contract chipmaker projects its 2-nanometer and A16 capacity will grow at a 70% CAGR from 2026 to 2028, while CoWoS advanced packaging capacity expands at over 80% CAGR from 2022 to 2027. AI accelerator wafer demand alone is projected to grow 11-fold between 2022 and 2026.\n\nTSMC plans nine new wafer fab and packaging facility phases in 2026, including a 1.8x output increase at its Arizona site, where four fabs and a packaging plant are now planned. A second fab in Japan is being upgraded to 3-nanometer, and a new fab in Germany will produce 12 to 28-nanometer chips."}}